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Bulova
provides customers with a flexible test integration model in
which customers define the level of test services required.
Our test engineers can work to integrate an existing customer
test network into our manufacturing processes or provide full
test support services for product test development.
Testing capabilities include:
·
Automated Optical Inspection (AOI)
·
Automated X-Ray Inspection (AXI)
·
Environmental
Stress Screening (ESS)
·
Environmental
Vibration Testing (EVT)
·
In-circuit testing (ICT)
·
Burn-in
Automated Optical Inspection (AOI)
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Automated Optical Inspection provides fast,
repeatable machine inspection of circuit boards to
detect missing, incorrect, damaged, and misaligned
parts, as well as wrong polarity and solder bridges.
All data is uploaded to a central database to enable
real time remote monitoring and SPC data collection.
The entire inspection, review, and repair process is
traceable and paperless. |
Automated X-Ray Inspection (AXI)
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Automated X-Ray
Inspection provides state-of-the-art high-speed 3D
inspection of solder quality on all parts, including
BGA’s and QFN’s where visual inspection would be
difficult or impossible. Captured defects include
voids, shorts, insufficient solder, non-wetting, and
missing parts.
As
with AOI, all data is captured in a central database
to provide product tracking, production feedback,
and SPC data reporting, and the entire process is
paperless.
AOI + AXI = Total Coverage
With AOI and
AXI combined, Bulova Technologies can perform automated
inspection of close to 100% of a circuit board, evaluating
parts and solder, in a fraction of the time taken by
traditional visual inspection, coupled with efficient data
collection and reporting.
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Environmental Stress Screening
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Environmental
stress screening
(ESS) is used to induce failures in a product that
may be caused by design, defective parts, or
workmanship. ESS can include temperature cycling,
humidity exposure, and/or vibration testing. The
ultimate goal of ESS is to reduce field failures and
deliver optimum quality to the customer. Bulova uses
ESS for several product lines to meet the needs of a
variety of customers with diverse applications. |
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Thermotron Chamber F-32-CHMV-10-10-2
Temperature Range: -73° C to 175° C
Humidity Range: 20% to 95% Relative
Humidity
Pulldown: 55° C to –53° C in Approx. 22 min.
Internal Dimensions: 39” X 40” X 44”
Thermotron Chamber SM-16C
Temperature
Range: -73° C to 175° C
Humidity Range: 10% to 98% Relative Humidity
Pulldown:
25° C to –54° C in 40 min.
Heatup:
25° C to 125° C in 17 min.
Internal Dimensions: 30 X 30” X 30” |
Environmental
Vibration
Testing
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Ling / GenRad Vibration System
Frequency Range: Sine: 5
to 3,000 Hz
Random: 5 to 2,000 Hz
Rated
Force: Sine: 6,000 Force Pounds
Random:
5,000 Force Pounds
Armature
Weight: 43 Pounds
Armature
Dimension: 13.25” Diameter
Maximum
Acceleration: 136 g
Maximum
Velocity: 65 inch / sec
Maximum
Displacement: 1 inch peak-to-peak
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In-Circuit
and
Burn In
Testing
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Our high-speed in-circuit test capability can
be utilized for PCB assemblies. We frequently implement
customer developed, as well as Bulova developed, functional
test systems, burn-in systems, and other specialized ESS
testing for PCB assemblies, box builds, and
electronic/electro-mechanical systems.
Similar to ESS, burn-in
testing typically involves powering units while
exposing them to a constant elevated temperature.
This can be used to detect defects that would occur
in the infancy of a product, leading to improved
quality and customer satisfaction. |
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