Bulova produces a variety of printed circuit board assemblies using advanced technologies including surface mount, through-hole, ball grid array, and mixed technologies. Our experienced and well trained team designs, assembles, and tests your printed circuit board assemblies using state-of-the-art tools and advanced placement techniques.

Bulova's has long history of expertise in Printed Circuit Board Assembly.

·         High reliability soldering and assembly

·         Surface mount, through-hole, mixed technology

·         Fine pitch SMT

·         BGA

·         Conformal coating

We employ state-of-the-art equipment maximizing automation, speed, accuracy, repeatability, flexibility, precision and easy setup.

Throughout the manufacturing process, from bare board through reflow to final inspection and testing, we employ DFx fundamentals and quality and data tracking methodologies that allow Bulova to provide customers with agile, flexible and low-cost manufacturing solutions. 

Bulova is proud of its production team -- trained and certified to the highest industry standards for soldering and workmanship.